vacuum laminator

vacuum laminators can be semi-automatic, automatic or customized. vacuum laminator is developed by applying the original carrier film system technology and the high-precision hot press system technology to our conventional diaphragm-type vacuum laminator, which can meet both high processing precision and mass production requirements. diaphragm-type vacuum laminator provides excellent conformation of various build-up materials to fine patterns and via holes. in addition, the high-precision hot press unit provides uniform thickness and surface flatness. its main application is ic packaging substrates. other applications include the related manufacturing processes of fpc, ncf and led.

vacuum laminator

item name characteristics applications data sheets pdf
etertec

cvp-300
automatic vacuum laminator
▲ diaphraghm laminator
▲ for dry film / dfsm / buildup materials process
semiconductor / led packaging
ic substrate
etertec

cvp-600
automatic vacuum laminator
▲ rubber press laminator
▲ for dry film / dfsm / buildup materials process
semiconductor / led packaging
ic substrate
etertec

cvs-series
automatic vacuum laminator
▲ diaphraghm & servo-press laminator
▲ for buildup materials / molding film process
semiconductor / led packaging
ic substrate
etertec

efv-1000
multifunctional automatic / semi-automatic laminator
▲ diaphraghm laminator
▲ for dry film / dfsm process
ic substrate
pcb/fpcb
passive components
etertec

v-130/160
multifunctional semi-automatic laminator
▲ diaphraghm laminator
▲ for dry film / dfsm / led phospher film process
led
pcb/fpcb
passive components